|IQ Aligner® - Automated Single/Double-side UV-NIL System|
For semi-automatic or fully-automatic single and double-side UV-NIL processes.
The IQ Aligner automated double-side UV-NIL system allows for micromolding and nanoimprinting processes with stamps and wafers from 150 mm to 300mm diameter. Uniform contact force for high yield large area printing is provided by an EV Group proprietary chuck design which supports both soft and hard stamps. Configurations include release mechanisms for stamps from imprinted substrates.
* For micromolding applications of optical elements
* For fulll field nanoimprinting applications
* 3 independently controlled z-spindles for superior wedge compensation between stamp and substrate
* 3 independently controlled z-spindles for TTV control of imprint resist
* Soft UV-NIL processes utilizing soft working stamps
* EVG proprietary fully automated de-embossing function
* Resist dispense station integration
* Bond alignment and UV-bonding capabilities